Development of Self-Packaged High Frequency Circuits Using Micromachining Techniques

IEEE Transactions on Microwave Theory and Techniques

Volumn 43, Issue 9, 1995, Pages 2073-2080

  Drayton, Rhonda Franklin ^a   Katehi, Linda P B ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE NETWORKS; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT MANUFACTURE; MICROELECTRONIC PROCESSING; MICROMACHINING; NETWORK COMPONENTS; PASSIVE NETWORKS; PERFORMANCE; SEMICONDUCTING SILICON;

SELF PACKAGED HIGH FREQUENCY CIRCUITS;

MONOLITHIC INTEGRATED CIRCUITS;

EID: 0029375538     PISSN: 00189480     EISSN: 15579670     Source Type: Journal    
DOI: 10.1109/22.414543     Document Type: Article

References (24)

1. M. Yap, Y-C. Tai, W. R. McGrath, and C. Walker, “Silicon micromachined waveguides for millimeter and submillimeter wavelengths,” 3rd Int. Symp. Space Terahertz Technol. Proc., pp. 316–323, Mar. 1992.
2. T. M. Weller, L. P. B. Katehi, and G. M. Rebeiz, “High performance microshield line components,” IEEE Trans. Microwave Theory Tech., vol. 43, no. 3, pp. 534–543, Mar. 1995.
3. N. I. Dib and L. P. B. Katehi, “Impedance calculation for the microshield line,” IEEE Microwave Guided Wave Lett., vol. 2, no. 10, pp. 406–408, Oct. 1992.
4. S. Wedge, R. Compton, and D. Rutledge, PUFF Computer Aided Design for Microwave Integrated Circuits, Vers. 2.0.
5. N. Dib and L. Katehi, “Modeling of shielded CPW discontinuities using the space domain integral equation method (SDIE).” J. Electro. Waves Applicat., vol. 5, nos. 4/5, pp. 503–523, 1991.
6. M. El-Shandwily and N. Dib, “Spectral domain analysis of finlines with composite ferrite-dielectric substrate,” Int. J. Electronics, vol. 68, no. 4, pp. 571–583, Apr. 1990.
7. K. Kunz and R. Luebbers, The Finite Difference Time Domain Method for Electromagnetics. Florida: CRC Press, 1993.
8. G. Mur, “Absorbing boundary conditions for the finite-difference approximation of the time-domain electromagnetic-field equations,” IEEE Trans. Electromag. Compat., vol. 22, no. 11, pp. 377–382, Nov. 1981.
9. K. Mei and J. Fang, “Superabsorbtion—A method to improve absorbing boundary conditions,” IEEE Trans. Antennas Propagat., vol. 40, no. 9, pp. 1001–1010, Sept. 1992.
10. V. Betz and R. Mittra, “Comparison and evaluation of boundary conditions for the absorption of guided waves in an FDTD simulation,” IEEE Microwave Guided Wave Lett., vol. 2, no. 12, pp. 499–501, Dec. 1992.
11. X. Zhang and K. Mei, “Time-domain finite difference approach to the calculation of the frequency-dependent characteristics of microstrip discontinuities,” IEEE Trans. Microwave Theory Tech., vol. 36, no. 12, pp. 1775–1781, Dec. 1988.
12. D. Sheen, S. Ali, M. Abouzahra, and J. Kong, “Finite-difference time-domain method to the analysis of planar microstrip circuits,” IEEE Trans. Microwave Theory Tech., vol. 38, pp. 849–857, July 1990.
13. J. D. Montgomery, “Hybrid MIC North America markets,” Microwave J., vol. 32, no. 4, pp. 32–34, Apr. 1989.
14. H. R. Malone, “Antenna/MMIC packaging techniques for commercial applications,” 1992 IEEE Antenna Propagat. Soc. Int. Symp. Dig., vol. 3, pp. 1264–1268.
15. W. P. Harokopus, Jr., “High frequency characterization of open microstrip discontinuities,” Ph.D dissertation, The University of Michigan, Dec. 1991.
16. K. E. Petersen, “Silicon as a mechanical material,” Proc. IEEE, vol. 70, no. 5, pp. 420–457, May 1982.
17. E. W. Strid and K. R. Gleason, “Calibration methods for microwave wafer testing,” 1984 IEEE MTT-S Int. Microwave Symp. Dig., pp. 93–97.
18. G. Engen and C. Hoer, “Thru-reflect-line: An improved technique for calibrating the six-port automatic network analyzer,” IEEE Trans. Microwave Theory and Tech., vol. 27, no. 12, pp. 987–993, Dec. 1979.
19. M. Maury, S. March, and G. Simpson, “LRL calibration of vector automatic network analyzers,” Microwave J., pp. 387–391, May 1987.
20. G. Ghione and C. Naldi, “Coplanar waveguides for MMIC applications: Effect of upper shielding, conductor backing, finite-extent ground planes and line-to-line coupling,” IEEE Trans. Microwave Theory Tech., vol. 35, no. 3, pp. 260–267, Mar. 1987.
21. S. R. Taub and P. G. Young, “Attenuation and ∊eff of coplanar waveguide transmission lines on silicon substrates,” in Eleventh Annual Benjamin Franklin Symp. Antenna and Microwave Technol. in the 1990s, May 1993, pp. 8–11.
22. N. Dib, L. P. B. Katehi, G. E. Ponchak, R. N. Simons, “Theoretical and experimental characterization of coplanar waveguide discontinuities for filter applications,” IEEE Trans. Microwave Theory Tech., vol. 39, no. 5, pp. 873–882, May 1991.
23. W. Heinrich, “Full-wave analysis of conductor losses on MMIC transmission lines,” IEEE Trans. Microwave Theory Tech., vol. 38, no. 10, pp. 1468–1472, Oct. 1990.
24. T. E. van Deventer, “Characterization of two-dimensional high frequency microstrip and dielectric interconnects,” Ph.D dissertation, The University of Michigan, Dec. 1992.