Electroless deposition of bumps for TAB technology

Metal Finishing

Volumn 88, Issue 10, 1990, Pages 23-26

  Simon, J ^a   Zakel, E ^a   Reichl, H ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONTACTS - METALLIZING; SEMICONDUCTOR DEVICES - CONTACTS;

ELECTROLESS BUMPING; ELECTROLESS DEPOSITION;

ELECTROLESS PLATING;

EID: 0025497170     PISSN: 00260576     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.1990.122223     Document Type: Article

References (6)

1. Lowenheim Modern Electroplating 1974 John Wiley & Sons
2. M. Iwaba K. Yamakawa N. Iwase 5th IEEE/CHMT International Electronic Manufaturing Technolgy Symposium, Proceedings 1988 5th IEEE/CHMT International Electronic Manufaturing Technolgy Symposium, Proceedings 1988
3. K. Wong K. Chi A. Rangappan Plating an Surface Finishing 70 76 July 1988
4. A. M.T.P. van der Putten J.-W. G. de Bakker Proceedings Electrochemical Society Meeting 89 II Proceedings Electrochemical Society Meeting 89 II Florida 1989-Oct.
5. C. H Ting M. Paunovic P.L. Pai G. Chiu J. Electrochem. Soc. 136 2 462 466 1989
6. J. Simon H. Reichl Proceedings 2nd International TAB Symposium Proceedings 2nd International TAB Symposium San Jose 1990