Pretreatment of aluminum bondpads for electroless nickel bumping

Proceedings 1993 IEEE Multi-Chip Module Conference

Volumn , Issue , 1993, Pages 74-78

  Ostmann, A ^a   Simon, J ^a   Reichl, H ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; BONDING; ELECTRIC RESISTANCE; ELECTRONICS PACKAGING; FABRICATION; FLIP CHIP DEVICES; SEMICONDUCTOR DEVICES; SHEAR STRENGTH; THERMOANALYSIS;

ALUMINUM BONDPADS; ELECTROLESS NICKEL BUMPING; MULTICHIP MODULES;

ELECTROLESS PLATING;

EID: 0027132112     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)