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Volumn 43, Issue 5, 1999, Pages 681-706

Chip integration methodology for the IBM S/390 G5 and G6 custom microprocessors

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; INTEGRATED CIRCUIT LAYOUT; MICROPROCESSOR CHIPS; TRANSISTORS;

EID: 0033349830     PISSN: 00188646     EISSN: None     Source Type: Journal    
DOI: 10.1147/rd.435.0681     Document Type: Article
Times cited : (43)

References (19)
  • 7
    • 0001144080 scopus 로고    scopus 로고
    • Measurements and modeling of on chip transmission lines effects in a 400MHz microprocessor
    • April
    • P. Restle, P. Jenkins, A. Deutsch, and P. Cook, "Measurements and Modeling of On Chip Transmission Lines Effects in a 400MHz Microprocessor," IEEE J. Solid State Circuits 33, No. 4, 662-665 (April 1998).
    • (1998) IEEE J. Solid State Circuits , vol.33 , Issue.4 , pp. 662-665
    • Restle, P.1    Jenkins, P.2    Deutsch, A.3    Cook, P.4
  • 9
    • 0025458498 scopus 로고
    • An electromagnetic approach for modeling high-performance computer packages
    • July
    • B. J. Rubin, "An Electromagnetic Approach for Modeling High-Performance Computer Packages," IBM J. Res. Develop. 34, No. 4, 585-600 (July 1990).
    • (1990) IBM J. Res. Develop. , vol.34 , Issue.4 , pp. 585-600
    • Rubin, B.J.1
  • 12
    • 0018545259 scopus 로고
    • Resistive and inductive skin effect in rectangular conductors
    • W. T. Weeks, L. L. Wu, M. F. McAllister, and A. Singh, "Resistive and Inductive Skin Effect in Rectangular Conductors," IBM J. Res. Develop. 23, No. 6, 652-660 (1979).
    • (1979) IBM J. Res. Develop. , vol.23 , Issue.6 , pp. 652-660
    • Weeks, W.T.1    Wu, L.L.2    McAllister, M.F.3    Singh, A.4
  • 14
    • 0030216363 scopus 로고    scopus 로고
    • Modeling, measurement, and simulation of simultaneous switching noise
    • August
    • B. D. McCredie and W. D. Becker, "Modeling, Measurement, and Simulation of Simultaneous Switching Noise," IEEE Trans. Compon. Packag., Manuf. Technol. 19, 461-472 (August 1996).
    • (1996) IEEE Trans. Compon. Packag., Manuf. Technol. , vol.19 , pp. 461-472
    • McCredie, B.D.1    Becker, W.D.2
  • 19
    • 0032136312 scopus 로고    scopus 로고
    • Interconnect and circuit modeling techniques for full-chip power supply noise analysis
    • August
    • H. H. Chen and J. S. Neely, "Interconnect and Circuit Modeling Techniques for Full-Chip Power Supply Noise Analysis," IEEE Trans. Compon. Packag., Manuf. Technol. 21, No. 3, 209 (August 1998).
    • (1998) IEEE Trans. Compon. Packag., Manuf. Technol. , vol.21 , Issue.3 , pp. 209
    • Chen, H.H.1    Neely, J.S.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.