The accuracy of structural approximations employed in analysis of area array packages

IEEE Transactions on Components and Packaging Technologies

Volumn 22, Issue 4, 1999, Pages 525-533

  Hunter, Brian ^a  

^a University of Colorado at Boulder   (United States)

Author keywords

Area array packages; Finite element models; Interferometry; Moir ; Parametric models; Thermal strain stress

Indexed keywords

APPROXIMATION THEORY; COMPUTER SIMULATION; ERROR ANALYSIS; FINITE ELEMENT METHOD; INTERFEROMETRY; SEMICONDUCTOR DEVICE MODELS; SEMICONDUCTOR DEVICE STRUCTURES; SEMICONDUCTOR DEVICE TESTING; STRAIN; THERMAL STRESS;

AREA ARRAY PACKAGES; PLASTIC BALL GRID ARRAYS (PBGA);

ELECTRONICS PACKAGING;

EID: 0033338699     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.814968     Document Type: Article

References (14)

1. http://notes.sematech.org/mcpgs/roadmap4.pdf.
2. S. S. Manson Thermal Stress and Low-Cycle Fatigue. New York: McGraw-Hill 1966.
3. S. M. Heinrich and S. Shakya Improved analytical estimate of global CTE mismatch displacement in area-array solder joints Struct. Anal. Microelectron. Fiber Optics ASME vol. 16 pp. 155-167 1996.
4. S. M. Heinrich S. Shakya and P. S. Lee Effect of component heterogeneity on global CTE mismatch displacement in areal-array solder interconnects J. Electron. Packag. vol. 120 no. 1 pp. 12-17 Mar. 1998.
5. Shearing deformation in partial areal array: Analytical results J. Electron. Packag. vol. 120 no. 1 pp. 18-23 Mar. 1998.
6. B. Nagaraj and M. Mahalingam Package to board attach reliabil-ity-Methodology and case study on ompac package Adv. Electron. Packag. ASME vol. 4-1 pp. 537-543 1993.
7. A. Mertol Application of the taguchi method on the robust design of molded 225 plastic ball grid array packages IEEE Trans. Comp. Packag. Manufact. Technol. B vol. 18 pp. 734-743 Nov. 1995.
8. J. S. Corbin Finite element analysis for solder ball connect (SBC) structural design optimization IBM J. Res. Develop. vol. 37 pp. 585-596 1993.
9. Y. Guo C. K. Lim W. T. Chen and C. G. Woychik Solder ball connect (SBC) assemblies under thermal loading: I. Deformation measurement via Moiré interferometry and its interpretation IBM J. Res. Develop. vol. 37 pp. 635-647 1993.
10. D. Post B. Han and P. Ifju High Sensitivity Moiré. New York: Springer-Verlag 1994.
11. O. C. Zienkiewicz and R. L. Taylor The Finite Element Method. New York: McGraw-Hill 1989.
12. Thermal Stress and Strain in Microelectronics Packaging J. H. Lau Ed. New York: Van Nostrand Reinhold 1993.
13. P. M. Hall Creep and stress relaxation in solder joints Solder Joint Reliability Theory and Applications J. H. Lau Ed. New York: Van Nostrand Reinhold 1991 ch. 10 pp. 306-332.
14. ANSYS User's Manual Revision 5.0. Houston PA: Swanson Analysis Systems Dec. 1992.