Package-to-board attach reliability-methodology and case study on OMPAC package

American Society of Mechanical Engineers, EEP

Volumn 4-1, Issue , 1993, Pages 537-543

  Nagaraj, Ben ^a   Mahalingam, G ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; RELIABILITY; SOLDERING;

CASE STUDIES; OMPAC PACKAGE; SOLDER PADS;

ELECTRONICS PACKAGING;

EID: 0027752595     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)