Shearing deformation in partial areal arrays: Analytical results

Journal of Electronic Packaging, Transactions of the ASME

Volumn 120, Issue 1, 1998, Pages 18-23

  Heinrich, S M ^a   Shakya, S ^a   Lee, P S ^b  

^a Marquette University   (United States)

^b ROCKWELL AUTOMATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; ELASTICITY; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; SHEAR DEFORMATION; THERMAL EXPANSION;

COEFFICIENTS OF THERMAL EXPANSION (CTE);

SOLDERED JOINTS;

EID: 0032021848     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792279     Document Type: Article

References (8)

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3. Heinrich, S. M., Shakya, S., and Lee, P. S., 1998, “Improved Analytical Estimate of Global CTE Mismatch Displacement in Areal-Array Solder Joints,” ASME Journal of Electronic Packaging, Vol. 119, No. 4, pp. 218-227.
4. Heinrich, S. M., Shakya, S., and Lee, P. S., 1998, “Effect of Component Heterogeneity on Global CTE Mismatch Displacement in Areal-Array Solder Interconnects,” ASME Journal of Electronic Packaging, Vol. 120, No. 1, pp. 12-17.
5. Mirman, B., and Mirman, I., 1992, “Thermal Stresses in Axisymmetric Bimaterial Assemblies: Microelectronic Applications,” Advances in Electronic Packaging 1992, Vol. 1, ASME Publication EEP-Vol. 1-1, ASME, NY, pp. 425-435.
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7. Shakya, S., 1995, “Simplified Stress Analysis of Axisymmetric Solder Joint Under Thermal Loading,” M.S. thesis, Marquette University, Milwaukee, WI.
8. Suhir, E., 1986, “Calculated Thermally Induced Stresses in Adhesively Bonded and Soldered Assemblies,” Proc., 1986 International Symposium on Microelectronics, ISHM, Atlanta, GA, pp. 383-392.