Application of the Taguchi Method on the Robust Design of Molded 225 Plastic Ball Grid Array Packages

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 18, Issue 4, 1995, Pages 734-743

  Mertol, Atila ^a  

^a AGERE SYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FAILURE (MECHANICAL); FINITE ELEMENT METHOD; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT MANUFACTURE; OPTIMIZATION; ROBUSTNESS (CONTROL SYSTEMS); SOLDERING; STRAIN; THERMAL EFFECTS; THERMAL EXPANSION;

PACKAGE WARPAGE; PLASTIC BALL GRID ARRAY (PBGA) PACKAGES; SOFTWARE PACKAGE ANSYS; STRAIN DISTRIBUTION; TEMPERATURE CYCLING;

ELECTRONICS PACKAGING;

EID: 0029407717     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.475283     Document Type: Article

References (13)

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13. G. M. Marinescu, personal communications, CINDAS/Purdue University, Mar. 15, 1993.