Effect of component heterogeneity on global cte mismatch displacement in areal-array solder interconnects

Journal of Electronic Packaging, Transactions of the ASME

Volumn 120, Issue 1, 1998, Pages 12-17

  Heinrich, S M ^a   Shakya, S ^a   Lee, P S ^b  

^a Marquette University   (United States)

^b ROCKWELL AUTOMATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; ELECTRONICS PACKAGING; MATHEMATICAL MODELS; STIFFNESS; STRESS RELAXATION; SUBSTRATES; THERMAL CYCLING; THERMAL EXPANSION;

COEFFICIENTS OF THERMAL EXPANSION (CTE); TEMPERATURE EXCURSIONS;

SOLDERED JOINTS;

EID: 0032024235     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792278     Document Type: Article

References (4)

1. Boresi, A. P., and Chong, K. P., 1987, Elasticity in Engineering Mechanics, Elsevier Science Publishing Inc., NY.
2. Han, B., and Guo, Y., 1995, “Thermal Deformation Analysis of Various Electronic Packaging Products by Moiré and Microscopic Moiré Interferometry,” ASME Journal of Electronic Packaging, Vol. 117, No. 3, pp. 185-191.
3. Heinrich, S. M., Shakya, S., and Lee, P. S., 1998, “Improved Analytical Estimate of Global CTE Mismatch Displacement in Areal-Array Solder Joints,” ASME Journal of Heat Transfer, Vol. 119, No. 4, pp. 218-227.
4. Nagaraj, B., and Mahalingam, M., 1993, “Package-to-Board Attach Reliability—Methodology and Case Study on OMPAC Package,” Advances in Electronic Packaging 1993, Vol. 1, ASME-EEP Vol. 4-1, ASME, NY, pp. 537-543.