Improved analytical estimate of global CTE mismatch displacement in areal-array solder joints

American Society of Mechanical Engineers, EEP

Volumn 16, Issue , 1996, Pages 155-167

  Heinrich, S M ^a   Shakya, S ^a   Lee, P S ^a  

^a MARQUETTE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; ESTIMATION; MATHEMATICAL MODELS; SHEAR DEFORMATION; STIFFNESS; THERMAL EXPANSION;

AREAL ARRAY SOLDER JOINTS;

SOLDERED JOINTS;

EID: 0030379251     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Review

References (0)