Comparison of techniques for bonding VCSELS directly to ICs

Journal of Optics A: Pure and Applied Optics

Volumn 1, Issue 2, 1999, Pages 324-329

  Pu, Rui ^a   Hayes, E M ^a   Wilmsen, C W ^a   Choquette, K D ^b   Hou, H Q ^b   Geib, K M ^b  

^a Engineering Research Center and Hydraulics Laboratory   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CMOS INTEGRATED CIRCUITS; FLIP CHIP DEVICES; MESFET DEVICES; SEMICONDUCTING GALLIUM ARSENIDE; SEMICONDUCTING SILICON; SUBSTRATES;

FLIP CHIP BONDING PROCESS; HYBRID INTEGRATION; SMART PIXEL ARRAYS;

SEMICONDUCTOR LASERS;

EID: 0033331324     PISSN: 14644258     EISSN: None     Source Type: Journal    
DOI: 10.1088/1464-4258/1/2/343     Document Type: Article

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