Direct observation of the effects of Cu distribution on electromigration phenomena in submicron Al interconnects

Materials Research Society Symposium - Proceedings

Volumn 403, Issue , 1996, Pages 651-656

  Theiss, Silva K ^a   Prybyla, J A ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CURRENT DENSITY; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING SILICON; TRANSMISSION ELECTRON MICROSCOPY;

BONDING PAD; ENERGY DISPERSIVE X RAY SPECTROSCOPY; HILLOCKS;

ELECTROMIGRATION;

EID: 0030380416     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)