Numerical analysis of fine lead bondingeffect of pad thickness on interfacial deformation

IEEE Transactions on Components and Packaging Technologies

Volumn 22, Issue 2, 1999, Pages 291-298

  Takahashi, Yasuo ^a   Inoue, Michinobu ^a   Inoue, Katsunori ^b  

^a OSAKA UNIVERSITY   (Japan)

^b TOSHIBA CORPORATION   (Japan)

Author keywords

Inner lead bonding; Interconnection; Interfacial deformation; Middle lead bonding; Numerical simulation; TAB; Thermocompression bonding

Indexed keywords

BONDING; DEFORMATION; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT MANUFACTURE; SILICON; STRESS CONCENTRATION; SUBSTRATES;

INTERFACIAL DEFORMATION; TAPE AUTOMATED BONDING (TAB);

ELECTRONICS PACKAGING;

EID: 0033319679     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.774748     Document Type: Article

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