High performance ceramic QFP with fine pitch and high lead count

Sumitomo Metals

Volumn 45, Issue 2, 1993, Pages 165-172

  Nakatsuka, Yasuo ^a   Morita, Yasuyuki ^a   Fujii, Masafumi ^a   Ohtani, Hiroshi ^a   Takahashi, Eiji ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; ELECTRIC PROPERTIES; ELECTRONICS PACKAGING; LEAD; LSI CIRCUITS; METALLIC SUPERLATTICES; PERFORMANCE; SUBSTRATES; THIN FILMS;

CERAMIC QUAD FLAT PACKAGE (C-QFP); FINE PITCH; HIGH SPEED APPLICATION; LEAD COUNT; LEADFRAME; THERMAL SINGLE POINT BONDING SYSTEM;

CERAMIC MATERIALS;

EID: 0027542706     PISSN: 0371411X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)