An 820 Pin PGA for Ultralarge-Scale BiCMOS Devices

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 16, Issue 8, 1993, Pages 893-901

  Yamaji, Yasuhiro ^a   Ohno, Jun ichi ^a   Sudo, Toshio ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTRIC PROPERTIES; ELECTRONICS PACKAGING; FATIGUE TESTING; RELIABILITY; THERMAL EFFECTS;

ASIC DEVICES; BICMOS DEVICES; FATIGUE LIFE;

CMOS INTEGRATED CIRCUITS;

EID: 0027886135     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/33.273690     Document Type: Article

References (8)

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