Highly reliable inner lead bonding for tape carrier package

Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society

Volumn 15, Issue 4, 1997, Pages 591-599

  Serizawa, Koji ^a   Miura, Kazuma ^a   Ishida, Toshiharu ^a   Nakamura, Shozo ^a  

^a HITACHI LTD   (Japan)

Author keywords

Au bump; Cu lead; Defect; Inner lead bonding; Sn coating; Sn Pb coating; Solder

Indexed keywords

EID: 0004240265     PISSN: 02884771     EISSN: None     Source Type: Journal    
DOI: 10.2207/qjjws.15.591     Document Type: Article

References (5)

1. M.M.Karnowsky, et al., Trans. Met. Soc. AIME, vol.242 Nov., p. 1968.