Tape Automated Bonding Inner Lead Bonded Devices (TAB/ILB) Failure Analysis

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 16, Issue 3, 1993, Pages 304-310

  Tung, Chih Hang ^a   Kuo, Yen Shu ^a   Chang, Shih Ming ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTRONICS PACKAGING; FAILURE ANALYSIS; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUIT TESTING;

FLAW DETECTION; TAB CHIPS; TAPE AUTOMATED BONDING;

MICROPROCESSOR CHIPS;

EID: 0027596773     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/33.232057     Document Type: Article

References (7)

1. R. P. Kane, and C.C. Greco, “TAB bond reliability,” in Proc. Technical Conf. 9th Ann. hit. Electronics Packaging Conf., 1989, pp. 1339–1344.
2. H. E. Evans, J. P. O’Hara, and P. Viswanadham, “Reliability aspects of tape automated bonding second level assembly,” in Proc. Technical Conf. 9th Ann. Int. Electronics Packaging Conf., 1989, pp. 1375–1391.
3. T. Pitkanen, T. Salo, H. Sundquist, S. Lain, and P. Collander, “Improved IC reliability with TAB packaging,” in Proc. 39th Electronic Components Conf., 1989, pp. 190–193.
4. Y. Lee, and M. Andrews, “Failure mode analysis for TAB inner lead bonding,” in Proc. 39th Electronic Components Conf., 1989, pp. 325–334.
5. P. J. Pokela, T. M. Pitkanen, and R. Ahlroth, “The reliability of integrated circuits protected with Ti-W/Au bumps,” Thin Solid Film, vol. 166, pp, 113–120, 1988.
6. A. Buch, Fatigue Strength Calculation. Switzerland: Trans Tech., 1988, pp. 45, 332.
7. S. P. Murarka, “Diffusion barriers-for thin film metallizations,” Diffusion and Defect Data Part A: Defect and Diffusion Forum, vol. 59, pp. 99–110, 1988.