SCOPUS 정보 검색 플랫폼

Materials Research Society Symposium - Proceedings

Volumn 565, Issue , 1999, Pages 129-134

Multilevel damascene interconnection in integration of MOCVD Cu and low-k fluorinated amorphous carbon

(6) Yang, Hongning a Evans, David R a Nguyen, Tue a Stecker, Lisa H a Ulrich, Bruce a Hsu, S T a

a Sharp Microelectronics Technology Inc (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; AMORPHOUS FILMS; CARBON; CHEMICAL POLISHING; COPPER; DIFFUSION; FLUORINE; HEAT TREATMENT; MECHANICAL PROPERTIES; METALLORGANIC CHEMICAL VAPOR DEPOSITION; PLASMA ETCHING;

DAMASCENE; FLUORINATED AMORPHOUS CARBON;

DIELECTRIC FILMS;

EID: 0033297510 PISSN: 02729172 EISSN: None Source Type: Conference Proceeding
DOI: 10.1557/proc-565-129 Document Type: Article

Times cited : (3)

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