Thermal stability and structural evolution of low-K fluorinated amorphous carbon during thermal annealing

Materials Research Society Symposium - Proceedings

Volumn 511, Issue , 1998, Pages 233-239

  Yang, Hongning ^a   Tweet, Douglas J ^a   Ma, Yanjun ^a   Nguyen, Tue ^a   Evans, David R ^a   Hsu, S T ^a  

^a Sharp Microelectronics Technology Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COMPRESSIVE STRESS; FLUOROCARBONS; INTEGRATED CIRCUIT MANUFACTURE; LEAKAGE CURRENTS; PERMITTIVITY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; RESIDUAL STRESSES; STRUCTURE (COMPOSITION); TENSILE STRESS; THERMODYNAMIC STABILITY; VLSI CIRCUITS;

FLUORINATED AMORPHOUS CARBON; STRUCTURAL EVOLUTION;

AMORPHOUS FILMS;

EID: 0032292356     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-511-233     Document Type: Conference Paper

References (13)