The study of fluorinated amorphous carbon as low-k dielectric material and its interface with copper metallization

Materials Research Society Symposium - Proceedings

Volumn 564, Issue , 1999, Pages 565-570

  Ariel, N ^a   Eizenberg, M ^a   Tzou, E Y ^b  

^a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS MATERIALS; CARBON; CHEMICAL VAPOR DEPOSITION; COPPER; FLUORINE; HALOGENATION; INTERFACES (MATERIALS); METALLIZING; PLASMA APPLICATIONS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

FLUORINATED AMORPHOUS CARBON;

DIELECTRIC MATERIALS;

EID: 0033279149     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-564-565     Document Type: Article

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