Integration studies of plasma deposited fluorinated amorphous carbon

Materials Research Society Symposium - Proceedings

Volumn 511, Issue , 1998, Pages 259-264

  Mountsier, Thomas W ^a   Samuels, John A ^a   Swope, Richard S ^a  

^a NOVELLUS SYSTEMS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; AMORPHOUS MATERIALS; ANNEALING; DIELECTRIC MATERIALS; HARDNESS; INTERFACES (MATERIALS); MICROELECTRONIC PROCESSING; PERMITTIVITY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SHRINKAGE; THERMODYNAMIC STABILITY; THICK FILMS;

FLUORINATED AMORPHOUS CARBON; LOW DIELECTRIC CONSTANT; LOW WEIGHT LOSS; THICKNESS LOSS MEASUREMENT; WEIGHT LOSS MEASUREMENT;

FLUOROCARBONS;

EID: 0032301798     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-511-259     Document Type: Conference Paper

References (9)