Overcoming sheet resistance effects to enable electroplating of copper onto seedless barrier films

Proceedings of the IEEE 1999 International Interconnect Technology Conference, IITC 1999

Volumn , Issue , 1999, Pages 281-283

  Takahashi, Ken M ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; COPPER PLATING; CURRENT DENSITY; ELECTROPLATING; METALLIC FILMS; PLATING;

COPPER CONCENTRATION; CURRENT DISTRIBUTION; EXCHANGE CURRENT DENSITIES; METAL RESISTANCES; ORDERS OF MAGNITUDE; PHYSICAL AND CHEMICAL PROPERTIES; POLARIZATION PARAMETERS; THICK BARRIER LAYERS;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 0039034160     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.1999.787144     Document Type: Conference Paper

References (3)

1. K. M. Takahashi and M. E. Gross, "Analysis of transport phenomena in electroplated copper filling of submicran vias and trenches", in Proceedings of the Advanced Metallization Conference, October 6-8, 1998.
2. K. M. Takahashi, "Electroplating copper onto resistive barrier films", unpublished.
3. E. E. Famdon, F. C. Walsh, and S. A. Campbell, Journal of Applied Electrochemistry, Vol, 25, 1995, p. 574.