Extendibility of Cu damascene to 0.1 μm wide interconnections

Materials Research Society Symposium - Proceedings

Volumn 514, Issue , 1998, Pages 287-292

  Hu, C K ^a   Lee, K Y ^a   Gignac, L ^a   Rossnagel, S M ^a   Uzoh, C ^a   Chan, K ^a   Roper, P ^a   Harper, J M E ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CHEMICAL POLISHING; DIELECTRIC MATERIALS; ELECTRIC CONDUCTIVITY; ELECTRIC INSULATORS; ELECTRIC WIRING; ELECTRON BEAM LITHOGRAPHY; ELECTROPLATING; REACTIVE ION ETCHING;

CHEMICAL MECHANICAL POLISHING; IONIZED PHYSICAL VAPOR DEPOSITION;

COPPER;

EID: 0032288712     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-514-287     Document Type: Conference Paper

References (11)