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Volumn 20, Issue 5, 1999, Pages 254-255

Fabrication and characterization of sub-quarter-micron MOSFET's with a copper gate electrode

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; ELECTRODES; FABRICATION; GATES (TRANSISTOR); SILICON WAFERS;

EID: 0032690269     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/55.761031     Document Type: Article
Times cited : (16)

References (7)
  • 1
    • 0345454506 scopus 로고    scopus 로고
    • The National Technology Roadmap for Semiconductors, Semiconductor Industry Assoc., San Jose, CA, 1997
    • The National Technology Roadmap for Semiconductors, Semiconductor Industry Assoc., San Jose, CA, 1997.
  • 2
    • 0031236185 scopus 로고    scopus 로고
    • Reliable Ta-gate fully-depleted-SOI MOSFET technology featuring low-temperature processing
    • T. Ushiki, M. Yu, Y. Hirano, H. Shimada, M. Morita, and T. Ohmi, "Reliable Ta-gate fully-depleted-SOI MOSFET technology featuring low-temperature processing," IEEE Trans. Electron Devices, vol. 44, pp. 1467-1472, 1997.
    • (1997) IEEE Trans. Electron Devices , vol.44 , pp. 1467-1472
    • Ushiki, T.1    Yu, M.2    Hirano, Y.3    Shimada, H.4    Morita, M.5    Ohmi, T.6
  • 4
    • 84886448006 scopus 로고    scopus 로고
    • Sub-100-nm gate length metal gate NMOS transistors fabricated by a replacement gate process
    • A. Chatterjee et al., "Sub-100-nm gate length metal gate NMOS transistors fabricated by a replacement gate process, in IEDM Tech. Dig., 1997, pp. 821-824.
    • (1997) IEDM Tech. Dig. , pp. 821-824
    • Chatterjee, A.1
  • 5
    • 84886448019 scopus 로고    scopus 로고
    • Feasibility of using W/TiN as metal gate for conventional 0.13-μm CMOS technology and beyond
    • J. C. Hu et al., "Feasibility of using W/TiN as metal gate for conventional 0.13-μm CMOS technology and beyond," in IEDM Tech. Dig., 1997, pp. 825-828.
    • (1997) IEDM Tech. Dig. , pp. 825-828
    • Hu, J.C.1
  • 6
    • 0031210998 scopus 로고    scopus 로고
    • Manufacturability of chemical vapor deposition of copper
    • T. Nguyen, L. J. Charneski, and S.T. Hsu, "Manufacturability of chemical vapor deposition of copper," J. Electrochem. Soc., vol. 144, pp. 2829-2833, 1997.
    • (1997) J. Electrochem. Soc. , vol.144 , pp. 2829-2833
    • Nguyen, T.1    Charneski, L.J.2    Hsu, S.T.3
  • 7
    • 84975363343 scopus 로고
    • The etching of silicon nitride in phosphoric acid with silicon dioxide as a mask
    • W. van Gelder and V.E. Hauser, "The etching of silicon nitride in phosphoric acid with silicon dioxide as a mask," J. Electrochem. Soc., vol. 124, p. 869, 1977.
    • (1977) J. Electrochem. Soc. , vol.124 , pp. 869
    • Van Gelder, W.1    Hauser, V.E.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.