Effect of clamping conditions and built-in stresses on the thermopneumatic deflection of SiO2/Si membranes with various geometries

Sensors and Actuators, A: Physical

Volumn 74, Issue 1, 1999, Pages 174-177

  Malhaire, C ^a   Le Berre, M ^a   Febvre, D ^a   Barbier, D ^a   Pinard, P ^a  

^a INSTITUT DES NANOTECHNOLOGIES DE LYON   (France)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; MEMBRANES; SILICA; STRESS RELAXATION; THERMOELASTICITY;

CLAMPING; SILICON MEMBRANE; THERMOELASTIC STRESS;

SILICON WAFERS;

EID: 0032633053     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(98)00312-4     Document Type: Article

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