A proposed organic-silica film for inter-metal-dielectric application

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 38, Issue 3 A, 1999, Pages 1428-1432

  Sugahara, Satoshi ^a   Usami, Koh Ichi ^a   Matsumura, Masakiyo ^a  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

ab initio molecular orbital method; Alkylene group; Inter metal dielectric; Liquid phase deposition; Low k; Organic silica; Oxidation

Indexed keywords

ADHESION; CALCULATIONS; DEPOSITION; OXIDATION; PERMITTIVITY; SILICA; STRUCTURE (COMPOSITION); THERMAL CONDUCTIVITY;

AB INITIO MOLECULAR ORBITAL METHOD; INTERMETAL DIELECTRIC; LIQUID PHASE DEPOSITION;

DIELECTRIC FILMS;

EID: 0032625283     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.38.1428     Document Type: Article

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