Next generation lithography

Materials Science in Semiconductor Processing

Volumn 1, Issue 2, 1998, Pages 93-97

  Harriott, L R ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; ECONOMIC AND SOCIAL EFFECTS; ELECTRON BEAM LITHOGRAPHY; ELECTRONICS INDUSTRY; INTEGRATED CIRCUIT MANUFACTURE; MASKS; TECHNOLOGY;

EXTREME ULTRAVIOLET LITHOGRAPHY; ION PROJECTION LITHOGRAPHY; RESOLUTION ENHANCEMENT TECHNOLOGIES; SCALPEL PROJECTION ELECTRON BEAM LITHOGRAPHY; X RAY PROXIMITY;

PHOTOLITHOGRAPHY;

EID: 0032157621     PISSN: 13698001     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1369-8001(98)00019-5     Document Type: Article

References (6)

1. The National Technology Roadmap for Semiconductors. Semiconductor Industry Association.
2. Levenson MD. Wavefront Engineering from 500 to 100 nm CD. Proc. SPIE 1997;3051:2.
3. Silverman JP. X-ray Lithography: Status, Challenges and Outlook for 0.13 μm. J. Vac. Sci. Technol. B 1997;15:2117.
4. Gwyn C. 1998. Extreme Ultraviolet Lithography. To be published in J. Vac. Sci. Technol. B..
5. Melngailis J, Mondelli AA, Berry IL, Mohondro R. A Review of Ion Projection Lithography. J. Vac. Sci. Technol. B 1998;16:927.
6. Harriott LR. Scattering with Angular Limitation Projection Electron Beam Lithography. J. Vac. Sci. Technol. B 1997;15:2130, see also http://www.lucent.com/SCALPEL.