Si-to-Si wafer bonding using evaporated glass

International Conference on Solid-State Sensors and Actuators, Proceedings

Volumn 1, Issue , 1997, Pages 661-664

  de Reus, Roger ^a   Lindahl, Michael ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; BOND STRENGTH (MATERIALS); GLASS BONDING; INTERFACES (MATERIALS); MICROELECTRONIC PROCESSING; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS;

ANODIC BONDING; EVAPORATED GLASS;

MICROELECTROMECHANICAL DEVICES;

EID: 0030702594     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)