Wire button contact retainer board for 3-D interconnected MCMs

International Journal of Microcircuits and Electronic Packaging

Volumn 19, Issue 4, 1996, Pages 456-461

  Ackerman, Randel E ^a,b,c   Schaefer, Dean A ^a,c,d,e  

^a RAYTHEON COMPANY   (United States)

^b UNIVERSITY OF TEXAS AT AUSTIN   (United States)

^c E Systems

^d UNIVERSITY OF IOWA   (United States)

^e STANFORD UNIVERSITY   (United States)

Author keywords

3 D Interconnect; Multichip Modules (MCM); Rigid Flex Circuit; Wire Button Contact

Indexed keywords

CALCULATIONS; ELECTRIC CONTACTS; INTERCONNECTION NETWORKS; PERFORMANCE; THREE DIMENSIONAL;

THREE DIMENSIONAL INTERCONNECT; WIRE BUTTON CONTACT;

MULTICHIP MODULES;

EID: 0030400852     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (4)

1. Richard C. Eden, "Applicability of Diamond Substrates to Multi-Chip Modules," ISHM Proceedings, Orlando, Florida, October 21-23, pg. 365, 1991.
2. CINCH Connector Division, Elk Grove Village, Illinois; Cm:-APSE™ Test Report, April 15, 1991.
3. Report of Test on Fuzz Button™ Mounted in Interstitial PGA Retainer Board For Tecknit, August 6, 1993.
4. D.B. Harris and M.G. Pecht, "A Reliability Study of Fuzz ButtonTM Interconnects," Circuit World, Vol. 21, No. 2, pg. 17, 1995.