3D Packaging technology overview and mass memory applications

IEEE Aerospace Applications Conference Proceedings

Volumn 2, Issue , 1996, Pages 347-355

  Terrill, Rob ^a   Beene, Gary L ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DATA STORAGE EQUIPMENT; MICROELECTRONIC PROCESSING; MULTICHIP MODULES; SILICON WAFERS; SYSTEMS ANALYSIS; TECHNOLOGY; THREE DIMENSIONAL;

COMPARISON METRICS; MASS MEMORY APPLICATIONS; MULTI DIE PACKAGING; SINGLE DIE PACKAGING; THREE DIMENSIONAL PACKING TECHNOLOGY;

ELECTRONICS PACKAGING;

EID: 0029777955     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)