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Volumn 2, Issue , 1995, Pages 72-75
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Fracture strength of doped and undoped polysilicon
a
a
SIEMENS AG
(Germany)
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Author keywords
[No Author keywords available]
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Indexed keywords
ETCHING;
FRACTURE TESTING;
FRACTURE TOUGHNESS;
IN SITU PROCESSING;
ION IMPLANTATION;
MICROMACHINING;
REACTIVE ION ETCHING;
RESIDUAL STRESSES;
SEMICONDUCTING SILICON;
SEMICONDUCTOR DOPING;
STRESS CONCENTRATION;
TENSILE TESTING;
ETCHING TIME;
POLYSILICON;
RESIDUAL TENSILE STRESS;
TENSILE TEST STRUCTURES;
SEMICONDUCTING FILMS;
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EID: 0029489466
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (25)
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References (5)
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