Elastoplastic beam model for column-grid-array solder interconnects

TMS Annual Meeting

Volumn , Issue , 1997, Pages 295-303

  Swanson, J A ^a   Heinrich, S M ^a   Lee, P S ^a  

^a MARQUETTE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); ELASTOPLASTICITY; ELECTRONICS PACKAGING; MATHEMATICAL MODELS; SHEAR DEFORMATION; STIFFNESS; STRAIN;

COLUMN GRID ARRAYS (CGA); POISSON'S RATIO; SLENDERNESS RATIO; VON MISES CRITERION;

SOLDERED JOINTS;

EID: 0031335801     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)