Solder geometry prediction in electronic packaging: An overview

American Society of Mechanical Engineers, EEP

Volumn 19, Issue 2, 1997, Pages 1371-1376

  Heinrich, S M ^a   Lee, P S ^b  

^a Marquette University   (United States)

^b ROCKWELL AUTOMATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 5844406104     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Review

References (51)

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