-
1
-
-
84957462939
-
-
1989, vol. 1086, pp. 598-603.
-
C. Gabriel and J. C. Mitchener, "Reduced device damage using an ozone based photoresist removal process," in Proc. SPIE, 1989, vol. 1086, pp. 598-603.
-
"Reduced Device Damage Using An Ozone Based Photoresist Removal Process," in Proc. SPIE
-
-
Gabriel, C.1
Mitchener, J.C.2
-
2
-
-
0026867840
-
-
vol. 13, pp. 288-290, May 1992.
-
S. Fang and J. McVittie, "Thin-oxide damage from gate charging during plasma processing," IEEE Electron Device Lett., vol. 13, pp. 288-290, May 1992.
-
"Thin-oxide Damage from Gate Charging during Plasma Processing," IEEE Electron Device Lett.
-
-
Fang, S.1
McVittie, J.2
-
3
-
-
0026882443
-
-
vol. 13, pp. 347-349, June 1992.
-
S. Fang and J. McVittie, "A model and experiments for thin oxide damage from wafer charging in magnetron plasmas," IEEE Electron Device Lett., vol. 13, pp. 347-349, June 1992.
-
"A Model and Experiments for Thin Oxide Damage from Wafer Charging in Magnetron Plasmas," IEEE Electron Device Lett.
-
-
Fang, S.1
McVittie, J.2
-
4
-
-
85172941312
-
-
1985 Dry Process Symp., Inst. Elect. Eng. Jpn., 1985, pp. 132-137.
-
Y. Kawamoto, "MOS Gate insulator breakdown caused by exposure to plasma," in Proc. 1985 Dry Process Symp., Inst. Elect. Eng. Jpn., 1985, pp. 132-137.
-
"MOS Gate Insulator Breakdown Caused by Exposure to Plasma," in Proc.
-
-
Kawamoto, Y.1
-
5
-
-
85172940891
-
-
19th Conf. Solid-State Devices and Materials, 1987, pp. 195-198.
-
Y. Ksunokuni, K. Nojiri, S. Kuboshima, and K. Hirobe, "The effect of charge build-up on gate oxide breakdown during dry etching," in Ext. Abstr. 19th Conf. Solid-State Devices and Materials, 1987, pp. 195-198.
-
"The Effect of Charge Build-up on Gate Oxide Breakdown during Dry Etching," in Ext. Abstr.
-
-
Ksunokuni, Y.1
Nojiri, K.2
Kuboshima, S.3
Hirobe, K.4
-
6
-
-
0024907452
-
-
1989, pp. 73-74.
-
F. Shone, K. Wu, J. Shaw, E. Hodelet, S. Mittal, and A. Haranahalli, "Gate oxide charging and its elimination for metal antenna capacitor and transistor in VLSI CMOS double-layer metal technology," in Symp. VLSI Tech. Dig. Papers, 1989, pp. 73-74.
-
"Gate Oxide Charging and Its Elimination for Metal Antenna Capacitor and Transistor in VLSI CMOS Double-layer Metal Technology," in Symp. VLSI Tech. Dig. Papers
-
-
Shone, F.1
Wu, K.2
Shaw, J.3
Hodelet, E.4
Mittal, S.5
Haranahalli, A.6
-
7
-
-
85172940731
-
-
H. Shin, J. Ma, and C. Hu, "Impact of plasma charging damage and diode protection on scaled thin oxide," in IEDM Tech. Dig., 1993.
-
"Impact of Plasma Charging Damage and Diode Protection on Scaled Thin Oxide," in IEDM Tech. Dig., 1993.
-
-
Shin, H.1
Ma, J.2
Hu, C.3
-
8
-
-
0026839218
-
-
1992, pp. 37-41.
-
H. Shin, C.-C. King, and C. Hu, "Thin oxide damage by plasma etching and ashing processes," in Proc. IEEE IRPS, 1992, pp. 37-41.
-
"Thin Oxide Damage by Plasma Etching and Ashing Processes," in Proc. IEEE IRPS
-
-
Shin, H.1
King, C.-C.2
Hu, C.3
-
9
-
-
0026993978
-
-
vol. 13, pp. 600-602, Dec. 1992.
-
H. Shin and C. Hu, "Dependence of plasma-induced oxide charging current on Al antenna geometry," IEEE Electron Device Lett., vol. 13, pp. 600-602, Dec. 1992.
-
"Dependence of Plasma-induced Oxide Charging Current on Al Antenna Geometry," IEEE Electron Device Lett.
-
-
Shin, H.1
Hu, C.2
-
10
-
-
0024125531
-
-
vol. 35, pp. 2259-2267, Dec. 1988.
-
2 films," IEEE Trans. Electron Devices, vol. 35, pp. 2259-2267, Dec. 1988.
-
2 Films," IEEE Trans. Electron Devices
-
-
Olivo, P.1
Nguyen, T.2
Ricco, B.3
-
11
-
-
0026254804
-
-
vol. 11, pp. 632-634, 1991.
-
R. Rofan and C. Hu, "Stress-induced oxide leakage," IEEE Electron Device Lett., vol. 11, pp. 632-634, 1991.
-
"Stress-induced Oxide Leakage," IEEE Electron Device Lett.
-
-
Rofan, R.1
Hu, C.2
-
12
-
-
0027693956
-
-
vol. 14, pp. 509-511, Nov. 1993.
-
H. Shin, K. Noguchi, and C. Hu, "Modeling oxide thickness dependence of charging damage by plasma processing," IEEE Electron Device Lett., vol. 14, pp. 509-511, Nov. 1993.
-
"Modeling Oxide Thickness Dependence of Charging Damage by Plasma Processing," IEEE Electron Device Lett.
-
-
Shin, H.1
Noguchi, K.2
Hu, C.3
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