Thermally induced stress relaxation and densification of spin-on-glass thin films

Applied Physics Letters

Volumn 76, Issue 4, 2000, Pages 430-432

  Chiang, C K ^a   Wallace, W E ^a   Lynn, G W ^a,c   Feiler, D ^b   Xia, W ^b  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^b Rockwell Semiconductor Systems   (United States)

^c UNIVERSITY OF TENNESSEE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0013132805     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.125777     Document Type: Article

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