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Journal of Applied Electrochemistry

Volumn 27, Issue 3, 1997, Pages 299-307

Determination of the practical range of parameters during reverse-pulse current plating

(2) Roy, S a Landolt, D b

a NEWCASTLE UNIVERSITY (United Kingdom)

b EPFL (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; HYDRODYNAMICS; MASS TRANSFER; MICROSTRUCTURE; NUMERICAL ANALYSIS;

CHARGE BALANCE; REVERSE PULSE CURRENT PLATING; STEADY STATE MASS TRANSFER; TRANSIENT MASS TRANSFER;

ELECTROPLATING;

EID: 0031102699 PISSN: 0021891X EISSN: None Source Type: Journal
DOI: 10.1023/A:1018480713718 Document Type: Article

Times cited : (46)

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