Recent advances in underfill technology for flip-chip, ball grid array, and chip scale package applications

International Symposium on Electronic Materials and Packaging, EMAP 2000

Volumn , Issue , 2000, Pages 224-231

  Wang, Lejun ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAYS; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; MICROELECTRONICS; MODIFIED ATMOSPHERE PACKAGING;

ELECTRONIC DEVICE; HIGH RELIABILITY; MICROELECTRONIC PACKAGE; PARADIGM SHIFTS; UNDERFILL TECHNOLOGY; UNDERFILLING; UNDERFILLS; WAFER LEVEL;

CHIP SCALE PACKAGES;

EID: 0009555584     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2000.904159     Document Type: Conference Paper

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