Development of the wafer level compressive-flow underfill encapsulant

Proceedings - International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn , Issue , 1999, Pages 337-343

  Shi, S H ^a   Yamashita, T Y ^a   Wong, C P ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

B stage; Compressive flow; Epoxy resin; Underfill encapsulant; Wafer level packaging

Indexed keywords

CHIP SCALE PACKAGES; CURING; DIFFERENTIAL SCANNING CALORIMETRY; DRYING; ELECTRONICS PACKAGING; EPOXY RESINS; INTERFACES (MATERIALS); MICROPROCESSOR CHIPS; PACKAGING MATERIALS; SOLDERING; SURFACE MOUNT TECHNOLOGY; THERMAL EXPANSION; THERMOGRAVIMETRIC ANALYSIS;

B STAGES; COMPRESSIVE-FLOW; DYNAMIC MECHANICAL ANALYZER; ENCAPSULANTS; SOLDER INTERCONNECTIONS; THERMOGRAVIMETRIC ANALYZERS; THERMOMECHANICAL ANALYZERS; WAFER LEVEL PACKAGING;

FLIP CHIP DEVICES;

EID: 7244224564     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1999.757335     Document Type: Conference Paper

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