Novel thermally reworkable underfill encapsulants for flip-chip applications

IEEE Transactions on Advanced Packaging

Volumn 22, Issue 1, 1999, Pages 46-53

  Wang, Lejun ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Chip removal; Degradable epoxy; Flip chip; Flip chip rework; Removable underfill; Repairable underfill; Reworkable underfill; Thermally reworkable

Indexed keywords

EID: 0002045726     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.746542     Document Type: Article

References (11)

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