Anisotropic conductive film (ACF) flip-chip interconnect in over GHz RF clock distribution system

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Proceedings - Presented at Adhesives in Electronics 2000

Volumn , Issue , 2000, Pages 153-158

  Ryu, Woonghwan ^a   Yim, Myung Jin ^a   Paik, Kyung Wook ^a   Kim, Joungho ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Anisotropic conductive films; Clocks; Conducting materials; Environmentally friendly manufacturing techniques; Microwave devices; Microwave frequencies; Polymers; Power system interconnection; Power system modeling; Semiconductor materials

Indexed keywords

ADHESIVES; ANISOTROPY; CLOCKS; COATINGS; CONDUCTIVE FILMS; CONDUCTIVE MATERIALS; DESIGN; DIGITAL DEVICES; ELECTRIC POWER SYSTEM INTERCONNECTION; FILMS; FLIP CHIP DEVICES; GENETIC ALGORITHMS; INTEGRATED CIRCUIT TESTING; JOINING; MANUFACTURE; MICROWAVE DEVICES; MICROWAVE FREQUENCIES; MICROWAVES; PLASTIC COATINGS; POLYMERS; SCATTERING PARAMETERS; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE MODELS; SEMICONDUCTOR DEVICES; SEMICONDUCTOR MATERIALS; TIMING JITTER;

ANISOTROPIC CONDUCTIVE FILMS; CONDUCTING MATERIALS; MANUFACTURING TECHNIQUES; POWER SYSTEM INTERCONNECTION; POWER SYSTEM MODEL;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 0003606779     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.2000.860590     Document Type: Conference Paper

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