A study on warpage of flexible SS substrates for large area MCM-D packaging

Journal of Electronic Packaging, Transactions of the ASME

Volumn 122, Issue 2, 2000, Pages 86-91

  Dang, Anh X H ^a   Ume, I Charles ^a   Bhattacharya, Swapan K ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0002998050     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.483152     Document Type: Article

References (18)

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