A relative comparison of PWB warpage due to simulated infrared and wave soldering processes

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 807-815

  Sutherlin, W ^a   Polsky, Y ^a   Ume, I C ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOBILE MANUFACTURE; ELECTRONICS PACKAGING; NETWORK COMPONENTS; OVENS; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; COMPUTER CONTROL; COMPUTER SIMULATION; INFRARED RADIATION; PRINTED CIRCUIT DESIGN; PRINTED CIRCUIT MANUFACTURE; SOLDERING; THERMAL CYCLING;

ELECTRONIC COMPONENT; ELECTRONIC PACKAGING INDUSTRY; INSERTION PROCESS; MEASUREMENT SYSTEM; ON-LINE MEASUREMENT; OUT-OF-PLANE DISPLACEMENT; PRINTED WIRING BOARD ASSEMBLIES; TEMPERATURE PROFILES;

SOLDERING; ELECTRONICS PACKAGING;

SHADOW MOIRE TECHNIQUE;

EID: 0031633698     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678800     Document Type: Conference Paper

References (12)

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