Application of thermoelastic lamination theory to predict warpage of a symmetric and simply supported printed wiring board during temperature cycling

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 345-352

  Polsky, Y ^a   Ume, C ^a   Sutherlin, W ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COREMAKING; DIFFERENTIAL EQUATIONS; FORECASTING; LAMINATING; MECHANICAL PROPERTIES; NETWORK COMPONENTS; DEFORMATION; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; THERMAL CYCLING; THERMAL EFFECTS; THERMOELASTICITY;

CLASSICAL LAMINATION THEORY; CLOSED FORM SOLUTIONS; EQUATIONS OF EQUILIBRIA; LAMINATED PLATE THEORY; SUPPORT CONDITIONS; TEMPERATURE CYCLING; TEMPERATURE DEPENDENT; THERMALLY INDUCED WARPAGE;

PRINTED CIRCUIT BOARDS; ELECTRONICS PACKAGING;

THERMOELASTIC LAMINATION THEORY; WARPAGE;

EID: 0031625756     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678717     Document Type: Conference Paper

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