An Investigation into Moisture-Induced Cracking in Plastic Packages Using Thermal Analysis Techniques

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn 1996-November, Issue , 1996, Pages 411-417

  Chew, S ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CRACKS; ELECTRONICS PACKAGING; FAILURE (MECHANICAL); MOISTURE; SOLDERING; SURFACE MOUNT TECHNOLOGY; THERMOANALYSIS;

%MOISTURE; 'DRY' [; COMPOUND PROPERTY; DESIGN CHANGE; EPOXY MOLD COMPOUNDS; PLASTIC INTERFACES; PLASTIC PACKAGES; PRECAUTIONARY MEASURES; SOLDER REFLOW; THERMAL ANALYSIS TECHNIQUES;

PLASTIC MOLDS;

EID: 0042698223     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.31399/asm.cp.istfa1996p0411     Document Type: Conference Paper

References (11)

1. B. Ellis, " Chemistry and Technology Of Epoxy Resins" Blackie Academic, (1993).
2. L. Manzione, "Plastic Packaging of Microelectronic Devices" Van Nostrand Reinhold, New York (1990).
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4. Tan, G.L and T.B. Lim, 3rd IPFA, Singapore, 170-176 (1993).
5. Pecht, M. G., L. T. Nguyen and E B Hakim "Plastic-Encapsulated Microelectronics" John Wiley & Sons (1995).
6. Wisanrakkit, G. and J. K. Gillham, Polymer Characterisation, Amer. Chem. Soc, 143 (1990).
7. Hale, A., C. W. Macosko and H. E. Bair, "Macromolecules", 24, 2610-2621, (1991).
8. S. Chew, A Sim, P. H. Yeung and T. H. Kuah, Proceedings of 1st Asia-Pacific Conference on Materials & Processes in IC Encapsulation, 1300-1313, (1996).
9. S. Chew and A.C. Tan, Proceedings of 1st Asia-Pacific Conference on Materials & Processes in IC Encapsulation, 1500-1514, (1996).
10. S. Chew, Proceedings of 46th Electronic Components and Technology Conference, 1032-1038(1996).
11. S.Cheng, Thermal Characterisation of Macromolecules, Journal of Applied Polymer Science, Applied Polymer Symposium, 1989, 43, 315-371.