Package Related Failure Mechanisms in Plastic BGA Packages Used for ASIC Devices

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn 1996-November, Issue , 1996, Pages 269-276

  Parekh, K ^a   Milburn, R ^a   Georgia, K ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; BALL GRID ARRAYS; COPPER; CRACKS; DELAMINATION; FAILURE (MECHANICAL); FAILURE ANALYSIS; RELIABILITY ANALYSIS; SURFACE MOUNT TECHNOLOGY;

ASIC DEVICE; BALL GRID ARRAY PACKAGES; COPPER TRACES; FAILURE MECHANISM; GLOB-TOP; PAD ARRAYS; PLASTIC BALL GRID ARRAY PACKAGES; PLASTIC SURFACES; QUALIFICATION TESTING; RELIABILITY TESTING;

PRINTED CIRCUIT BOARDS;

EID: 0043199243     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.31399/asm.cp.istfa1996p0269     Document Type: Conference Paper

References (3)

1. Owens N. L. "Component Design Guidelines for PBGA" Proceedings of the 1996 winter Motorola AMT Symposium, vol I, pp 219-225.
2. Mulgaonker S., Lewis G., Heckman J. and Berg H. "Level 1 Interfaces for the Glob-Top BGA" Proceedings of the 1996 winter Motorola AMT Symposium, vol I, pp 242-247
3. Kelsall S.J. "Failure Mechanisms in Plastic Packages" IEEE International Reliability Physics Symposium Tutorial Notes 1992, pp 2b.1-2b.13.