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Volumn , Issue , 1996, Pages 392-397
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Plastic encapsulated microcircuits (PEM) qualification testing
a
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Author keywords
[No Author keywords available]
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Indexed keywords
AVIONICS;
ENCAPSULATION;
FAILURE ANALYSIS;
INTEGRATED CIRCUIT TESTING;
SURFACE MOUNT TECHNOLOGY;
THERMAL CYCLING;
THERMAL EFFECTS;
THERMAL EXPANSION;
AVIONICS APPLICATIONS;
HIGHLY ACCELERATED STRESS TEST;
MICRO CIRCUITS QUALIFICATION TESTING;
PART FAILURE MECHANISMS;
PLASTIC DISCRETE DEVICES;
PLASTIC DUAL IN LINE;
PLASTIC ENCAPSULATED MICROCIRCUITS;
PLASTIC LEADED CHIP CARRIER;
PLASTIC QUAD FLAT PACKAGE;
TEMPERATURE CYCLE TEST;
ELECTRONICS PACKAGING;
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EID: 0029709213
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Article |
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Times cited : (6)
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References (15)
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