The reliability of plastic ball grid array package

2nd 1998 IEMT/IMC Symposium

Volumn 1998-April, Issue , 1998, Pages 35-39

  Sawada, Y ^a   Yamaguchi, A ^a   Oka, S ^a   Fujioka, H ^a  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BOND STRENGTH (MATERIALS); CRACKS; ELECTRONICS PACKAGING; FRACTURE; FRACTURE TOUGHNESS; GOLD PLATING; MATERIALS PROPERTIES; MICROELECTRONICS; MOISTURE; RELIABILITY; SOLDERING;

CRACK RESISTANCE; DIE-ATTACH MATERIALS; MOISTURE ABSORPTION; PLASTIC BALL GRID ARRAY PACKAGES; PLASTIC BALL GRID ARRAYS; REFLOW--SOLDERING; THERMAL CYCLING STABILITIES; THERMO-MECHANICAL STRESS;

BALL GRID ARRAYS;

EID: 5444276189     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMTIM.1998.704505     Document Type: Conference Paper

References (4)

1. J. E. Galloway, B. M. Miles, "Moisture Absorption and Desorption Predictions for Plastic Ball GridArray Packages" IEEE Transactions on Components, Packaging, Manufacturing Technology-Part A, VOL. 20, No. 3, pp. 274-279, September 1997.
2. L. Yip, T. Massingill, H. Naini, "Moisture Sensitivity Evaluation of Ball Grid Array Packages" 1996 Electronic Components and Technology conference, pp. 829-835
3. G. Tan, C. Hoo, G. Chew, J. Low, et al., "Reliability Assessment of BGA Packages" 1996 Electronic Components and Technology Conference, pp. 687-693
4. K. Tada, M. Sato, H. Fujioka, H. Kanegae, "Generation Mechanism of Initial Delamination On Pop Corn Phenomena of SMDs" ISHM'95 Proceedings, pp. 18-23