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1
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0001197855
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and references therein
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R. A. Gottscho, C. W. Jurgensen, and D. J. Vitkavage, J. Vac. Sci. Technol. B 10, 2133 (1992), and references therein.
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Gottscho, R.A.1
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2
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0001890931
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Design of High-Density Plasma Sources for Materials Processing
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edited by M. H. Francombe and J. L. Vossen Academic, New York
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M. A. Lieberman and R. A. Gottscho, Design of High-Density Plasma Sources for Materials Processing, Physics of Thin Films Vol. 18, edited by M. H. Francombe and J. L. Vossen (Academic, New York, 1994).
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Lieberman, M.A.1
Gottscho, R.A.2
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3
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0029292835
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T. Nozawa, T. Kinoshita, T. Nishizuka, A. Narai, T. Inoue, and A. Nakaue, Jpn. J. Appl. Phys. 34, 2107 (1995).
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Nozawa, T.1
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Nishizuka, T.3
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Nakaue, A.6
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4
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0029291247
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N. Fujiwara, T. Maruyama, and M. Yoneda, Jpn. J. Appl. Phys. 34, 2095 (1995); 35, 2450 (1996).
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Fujiwara, N.1
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5
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0030125045
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N. Fujiwara, T. Maruyama, and M. Yoneda, Jpn. J. Appl. Phys. 34, 2095 (1995); 35, 2450 (1996).
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7
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0028529702
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K. Hashimoto, Jpn. J. Appl. Phys. 32, 6109 (1993); 33, 6013 (1994).
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14
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85033177940
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-
note
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The difference between the potentials of the edge line (low) and the neighboring line (high) steers the ions approaching the trench bottom towards the low equipotential. Since more ions impinge on the bottom surface near the sidewall foot of the edge line, a larger positive potential builds up at that location, resulting in an asymmetric potential distribution at the trench bottom. The symmetric potential distribution calculated by Kinoshita et al. (Ref. 6) is not physical and suggests that notching should occur at both sidewalls confining the edge trench, contrary to experimental evidence (Refs. 3 and 4).
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-
-
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15
-
-
85033172270
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-
note
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This conjecture is based on maintaining the substrate potential close to 0 V.
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16
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0000191899
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G. S. Hwang, C. M. Anderson, M. J. Gordon, T. A. Moore, T. K. Minton, and K. P. Giapis, Phys. Rev. Lett. 77, 3049 (1996).
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Hwang, G.S.1
Anderson, C.M.2
Gordon, M.J.3
Moore, T.A.4
Minton, T.K.5
Giapis, K.P.6
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