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1
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84942601668
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Silicon nano-transistors and breaking the 10 nm physical gate length barrier
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Salt Lake City, Utah, 24 June
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R. Chau, B. Doyle, M. Doczy, S. Datta, S. Hareland, B. Jin, J. Kavalieros, and M. Metz, Silicon Nano-Transistors and Breaking the 10 nm Physical Gate Length Barrier, 61st Device Research Conference, Salt Lake City, Utah, 24 June 2003.
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(2003)
61st Device Research Conference
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Chau, R.1
Doyle, B.2
Doczy, M.3
Datta, S.4
Hareland, S.5
Jin, B.6
Kavalieros, J.7
Metz, M.8
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2
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0001114414
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S. Chung, J. Yu, and J. Heath, Appl. Phys. Lett. 76, 2068 (2000); Y. Huang, X. Duan, Y. Cui, L. J. Lauhon, K.-H Kim, and C. M. Lieber, Science 294, 1313 (2001).
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(2000)
Appl. Phys. Lett.
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, pp. 2068
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Chung, S.1
Yu, J.2
Heath, J.3
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3
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0035834415
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S. Chung, J. Yu, and J. Heath, Appl. Phys. Lett. 76, 2068 (2000); Y. Huang, X. Duan, Y. Cui, L. J. Lauhon, K.-H Kim, and C. M. Lieber, Science 294, 1313 (2001).
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(2001)
Science
, vol.294
, pp. 1313
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Huang, Y.1
Duan, X.2
Cui, Y.3
Lauhon, L.J.4
Kim, K.-H.5
Lieber, C.M.6
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4
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0037418895
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N. Melosh, A. Boukai, F. Diana, B. Gerardot, A. Badolato, P. M. Petroff, and J. R. Heath, Science 300, 112 (2003).
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(2003)
Science
, vol.300
, pp. 112
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Melosh, N.1
Boukai, A.2
Diana, F.3
Gerardot, B.4
Badolato, A.5
Petroff, P.M.6
Heath, J.R.7
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5
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9944262845
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note
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The Pt is deposited using an electron-beam evaporator and a self-aligned shadow mask technique. For the wires shown in Fig. 1, 8 nm of Pt was deposited at an evaporation angle of 15° above the plane of the sample.
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6
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9944251315
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Ibis Technology Corporation, Danvers, MA
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Ibis Technology Corporation, Danvers, MA.
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7
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9944237740
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note
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For the 4 in. SOI substrates, 75 nm of plasma enhanced chemical-vapor deposition grown oxide is deposited. This is followed by a selective etch to open windows above the nanowire sections.
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8
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0003699181
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Lattice, Sunset Beach, California
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2 at 20 sccm (denotes cubic centimeter per minute at STP) /30 sccm/2.5 sccm respectively, and an overall pressure of 5 mT. The rf power was 40 W and the etch time was determined using an end-point detector (interferometer). S. Wolf and R. N. Tauber, Silicon processing for the VLSI era (Lattice, Sunset Beach, California, 2000); Handbook of advanced plasma processing techniques, edited by R. J. Shul and S. J. Pearton (Springer, Berlin, 2000).
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(2000)
Silicon Processing for the VLSI Era
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Wolf, S.1
Tauber, R.N.2
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9
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0003747961
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Springer, Berlin
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2 at 20 sccm (denotes cubic centimeter per minute at STP) /30 sccm/2.5 sccm respectively, and an overall pressure of 5 mT. The rf power was 40 W and the etch time was determined using an end-point detector (interferometer). S. Wolf and R. N. Tauber, Silicon processing for the VLSI era (Lattice, Sunset Beach, California, 2000); Handbook of advanced plasma processing techniques, edited by R. J. Shul and S. J. Pearton (Springer, Berlin, 2000).
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(2000)
Handbook of Advanced Plasma Processing Techniques
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Shul, R.J.1
Pearton, S.J.2
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10
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9944238221
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note
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This value is calculated using the dimensions of the nanowires as measured via the SEM and using the resistivity measured for the bulk substrate, assuming 3 NWs are contacted for each electrode. Fluctuations due to the varying numbers of wires contacted are not significant on the scale of the variation between the substrates.
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11
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9944263353
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Emulsitone Company, Whippany, New Jersey
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Emulsitone Company, Whippany, New Jersey.
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12
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9944221412
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note
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The look-up table was generated by measuring the four-point resistivity of a series of doped samples annealed at various temperatures and times. The temperatures ranged from 800 to 1000°C and the times from 1 to 8 min.
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13
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9944239701
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note
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Resistance values were measured for wires from 2.5 to 22.5 μm in length.
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15
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0035902938
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Y. Cui, Q. Wei, H. Park, and C. M. Lieber, Science 293, 1289 (2001).
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(2001)
Science
, vol.293
, pp. 1289
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Cui, Y.1
Wei, Q.2
Park, H.3
Lieber, C.M.4
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17
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0000063661
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T. Ono, H. Saitoh, and M. Esashi, Appl. Phys. Lett. 70, 1852 (1997); A. Tao, F. Kim, C. Hess, J. Goldberger, R. He, Y. Sun, Y. Xia, and P. Yang, Nano Lett. 3, 1229 (2003); Y. Yin, B. Gates, and Y. Xia, Adv. Mater. (Weinheim, Ger.) 12, 1426 (2000).
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(1997)
Appl. Phys. Lett.
, vol.70
, pp. 1852
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Ono, T.1
Saitoh, H.2
Esashi, M.3
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18
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0141845141
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T. Ono, H. Saitoh, and M. Esashi, Appl. Phys. Lett. 70, 1852 (1997); A. Tao, F. Kim, C. Hess, J. Goldberger, R. He, Y. Sun, Y. Xia, and P. Yang, Nano Lett. 3, 1229 (2003); Y. Yin, B. Gates, and Y. Xia, Adv. Mater. (Weinheim, Ger.) 12, 1426 (2000).
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(2003)
Nano Lett.
, vol.3
, pp. 1229
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Tao, A.1
Kim, F.2
Hess, C.3
Goldberger, J.4
He, R.5
Sun, Y.6
Xia, Y.7
Yang, P.8
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19
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0034301136
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Weinheim, Ger.
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T. Ono, H. Saitoh, and M. Esashi, Appl. Phys. Lett. 70, 1852 (1997); A. Tao, F. Kim, C. Hess, J. Goldberger, R. He, Y. Sun, Y. Xia, and P. Yang, Nano Lett. 3, 1229 (2003); Y. Yin, B. Gates, and Y. Xia, Adv. Mater. (Weinheim, Ger.) 12, 1426 (2000).
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(2000)
Adv. Mater.
, vol.12
, pp. 1426
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Yin, Y.1
Gates, B.2
Xia, Y.3
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