Binding specificity of a peptide on semiconductor surfaces

Nano Letters

Volumn 4, Issue 11, 2004, Pages 2115-2120

  Goede, Karsten ^a,b   Busch, Peter ^a,c,d   Grundmann, Marius ^a  

^a UNIVERSITY OF LEIPZIG   (Germany)

^b Inst F Experimentelle Physik II   (Germany)

^c Inst F Experimentelle Physik I   (Germany)

^d LEIBNIZ INSTITUTE OF POLYMER RESEARCH DRESDEN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION COEFFICIENTS; BINDING SPECIFICITY; PEPTIDES; SEMICONDUCTOR SURFACES;

ADHESION; AMINO ACIDS; ATOMIC FORCE MICROSCOPY; DNA; SEMICONDUCTING ALUMINUM COMPOUNDS; SEMICONDUCTING SILICON; SURFACE CHEMISTRY; SYNTHESIS (CHEMICAL);

PROTEINS;

EID: 9744243512     PISSN: 15306984     EISSN: None     Source Type: Journal    
DOI: 10.1021/nl048829p     Document Type: Article

References (39)

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23. 2O (87.5:12.5 v/v) followed by a water rinse and distilled water bath for 2 min. This etch does not attack the pure semiconductor surfaces. Si samples showed typical hydrophobic properties after etching, indicating a clean Si surface. We have investigated the clean semiconductor surfaces by AFM to estimate the cleanness and flatness of the respective surfaces. The maximum particle coverage was 0.2%, which is well below the peptide PACs discussed in the text. After images were leveled by a first-order plane fit when necessary to remove a sample tilt, the maximum roughness rms of the clean (100) sample surfaces was 0.37 nm, while for most samples the roughness rms value was well below 0.30 nm. These values are typical for freshly etched surfaces of the investigated semiconductors.
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